The high temperature produced in high density and high speed operation following Moore’s Law in Semiconductor industry is one barrier which is hard to get rid of. New material and new method of packaging test can improve these issues. It becomes more important to monitor the stress and strain of the molds or fixtures for that the temperature stability and the exerting force uniformity of the molds or fixtures are highly requested on these operation processes.

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Examples of the applications:

1 Three point bending test on the packaged PC board.

2 Drop impact test on the packaged PC board.

3 structural stress / strain measurement between

   the chip and the PCB.